|
*.GTL TopLayer顶层走线
1 a# F8 N$ {& O# N+ | *.GBL BottomLayer底层走线
0 K6 l5 C- R& A/ Y O *.GTO TopOverlay顶层丝印字& G4 B, h! q: ?' j- R( ]: w+ P) J: Q
*.GBO BottomOverlay底层丝印
, s3 f, C, p# \ *.GTS TopSolder顶层阻焊5 l$ L2 I( }1 G, b5 ?
*.GBS BottomSolder底层阻焊, ^! l" B+ P1 m4 @( m; D
*.GTP TopPaste顶层贴片钢网3 S" [$ g [' Z' Q" a
*.GBP BottomPaste底层贴片钢网
6 t9 j# z; D( f: S0 k5 `9 O' Y *.GPT Top Pad Master顶层主焊盘
0 h3 b: B( ?/ v) t' r *.GPB Bottom Pad Master底层主焊盘
, i2 M* v, z- A& v/ ~( d X *.G1,*.G2,.. MidLayer1,2,..内层走线+ b3 p3 r h" Q1 K" w/ Q
*.GP1,*.GP2,.. InternalPlane1,2,..内层平面1,2,..
5 y$ J4 u: {2 P% k+ d- d5 U; z *.GM1 ,*GM2,.. Mechanical1,2,..机械层1,2,..
, y. M' H( k) h. R# \ *.GKO KeepOutLayer禁止布线层(可做板子外形)
) K$ ^ @! C$ y *.GG1 DrillGuide钻孔位置层* I, v \* C) T' C$ K/ t1 J
*.GD1 DrillDrawing钻孔图层 *drill 钻孔文件
8 f" Q! w, T, v7 J *.TXT 分孔图表- E2 T7 j1 R! e
*.APR 光圈表文件" ?3 z0 ^9 a0 [
*.DRR 钻孔报告文件" e( m- z- x9 K% G, _7 G b
|
|