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*.GTL TopLayer顶层走线 . w }( B5 |6 {5 B$ w
*.GBL BottomLayer底层走线
5 q) ~, `9 m+ T8 t: Z*.GTO TopOverlay顶层丝印字
/ D, \! ^1 k8 a3 E1 p*.GBO BottomOverlay底层丝印1 }" ~9 W2 {- a6 K* B4 w m
*.GTS TopSolder顶层阻焊 7 y8 f o$ C' t% y/ X9 `
*.GBS BottomSolder底层阻焊 & J. @# Y, s) ]* ^, L
*.GTP TopPaste顶层贴片钢网
) _( ?; A( ?- e$ P*.GBP BottomPaste底层贴片钢网 & [) _9 _( C. ~4 m7 x
*.GPT Top Pad Master顶层主焊盘 . |+ ?$ v- @3 T
*.GPB Bottom Pad Master底层主焊盘
4 w) I1 x: P6 u( J5 n. K$ ]*.G1,*.G2,.. MidLayer1,2,..内层走线
0 X F# n5 _7 Q5 X*.GP1,*.GP2,.. InternalPlane1,2,..内层平面1,2,..
2 K, _& d9 [' k*.GM1 ,*GM2,.. Mechanical1,2,..机械层1,2,.& x* l% G; ?7 T4 |; {& ?+ \5 n
. *.GKO KeepOutLayer禁止布线层(可做板子外形)
$ `* N0 i+ R3 F2 G& @*.GG1 DrillGuide钻孔位置层 * B m! n @! C$ I
*.GD1 DrillDrawing钻孔图层
5 C/ k" o1 l8 y*drill 钻孔文件 , J, k5 x8 E) _% c+ F% Q7 D" z
*.TXT 分孔图表9 D0 Q" G! @- n& w) n$ F
*.APR 光圈表文件 3 {$ Z" k y& O2 x% t3 w7 l- h6 Y
*.DRR 钻孔报告文件QQ 800058721 | ! ?/ c9 k- q' b$ h% N% { J
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